Universidade Federal do Rio Grande do Sul Engenharia Elétrica Circuitos Eletrônicos Integrados – ENG04061 Testes de Circuitos Eletrônicos Integrados Stevan Silveira Leandro Prytula Argus Luconi Rosenhaim

Site: Criação: 1968 Mercado: Worldwide Empregados: 400 em Chandler, >22k worldwide Localização: Matriz: Chandler AZ – USA – Headquarters Filiais: China, Japão, Coréia, Filipinas, Singapura e Taiwan. Expansão: Vê a necessidade de aumentar a capacidade de produção para atender os clientes. Amkor Technology, Inc.

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Dados de Vendas Amkor Technology, Inc.

Advanced Micro Devices, Inc. Marvell Technology Group, Ltd. Altera Corporation Mediatek, Inc. Analog Devices, Inc. NEC Corporation Atheros Communication, Inc. NXP Semiconductors Atmel Corporation RF Micro Devices, Inc. Avago Technologies, Pte Samsung Electronics Corporation, Ltd. Broadcom Corporation Amkor Technology, Inc. Sony Semiconductor Corporation Conexant Systems, Inc. ST Microelectronics, N.V. Freescale Semiconductor, Inc. Texas Instruments, Inc. IBM Toshiba Corporation Infineon Technologies AG Qualcomm Incorporated Intel Corporation Xilinx, Inc. LSI Corporation Principais clientes

Serviços: 1. Testes de desenvolvimento: Abrange o desenvolvimento de programas de teste, administração de projetos, caracterização, prototipação. 2. Wafer Probe: Abrange a inspeção visual e teste elétrico do wafer contra defeitos antes do encapsulamento. 3.Testes Finais: Processo de ensaio de cada aparelho/circuito depois de ter sido encapsulado. Esse teste analisa os atributos de cada dispositivo e determina se ele atende aos critérios estabelecidos pelo cliente * Os testes incluem circuitos digitais, lineares, sinais mistos, memórias, rádio frequência (especialidade da empresa) e integrações dessas tecnologias. Amkor Technology, Inc.

Testes de desenvolvimento: Amkor Technology, Inc. Project management process(s) Rapid first article development Advanced wafer probe Low cost RF probe Hardware (contactor, load board, probe card, handler kits) Robust contacting solutions aligned with Amkor's bump and package roadmap Novel test solution for low cost, bottom PoP (Package-on-Package) SiP module test strategies (including in-line test) SiP module Automation of system level test solutions Program conversion Multi-site test Strip test for punch and saw devices (low mix / high volume)

Wafer Probe: Amkor Technology, Inc. High volume production test for 300mm, 200mm and 150mm wafers300mm Full temperature range (-55oC to +150oC) Thin wafer handling capabilities (<150um) RF probe capabalities DPS (Die processing services) DPS Clean room environment Multi-site probe Probe card repair capabilities Bake retention Bumped wafer probe Electronic Assembly Support: Die attach wafer mapping (ALPS) Edge dies exclusion Wafer map template generation Inkless probe Probe wafer mapping

Testes finais: Amkor Technology, Inc. High volume production final test Full temperature testing capabilities Yield and capacity analysis Highly skilled factory test engineering support Wide range of test and handling equipment Custom test processing - Commercial / Military flows and mark after tests High volume strip test

Equipamentos de teste Amkor Technology, Inc.

Testes completos Amkor Technology, Inc. Comunicação: GPS, DVB-H, T-DMB, ISDBT receivers, demods, base bands, SiP, SCSPSCSP Dual sided PoP ( package on package ) contactors, 2G / 3G baseband Advanced media processor SoC(s) Quadsite celluar Tx front end SiP modules GPS receiver and baseband BlueTooth SoC radio RF probe – WLCSP die salesWLCSP Multiple die / system in package solutions for OEM(s)Multiple die Cellular power amplifier + transceiver modules, SiP, HEDGE LNA, Video Amplifiers & Drivers Noise cancellation Consumidores: Biometric sensors, MEMS, Quad site fingerprint sensorMEMS x16 Power FET & Op Amp solutions MOSFET strip test x32 Memory Card solutions LVDS timing controller LCD/PDP display Image stabilizer & processors, digital still camera (DSC) USB2.0 / MP3 processor Hard disc controller Microcontrollers Compass IC

Site: Local: Orleans MA - USA Criação: 1986 Mercado: Worldwide Empregados: < 50 Wafer Inspection Services, Inc.

Serviços: Wafer Inspection Services, Inc. Audits Installations Deinstallations Operator Training Applications Training Technical Support Preventive Maintenance Maintenance Training Per Call Service Full time On Site Service

Serviços: Wafer Inspection Services, Inc. NIST Calibration Wafers (PSLs) NIST Thin Films Calibration Wafers JDSU New Lasers SP2 remanufactured lasers Replacement Lamps Robotics service / repair PRI/Equipe, Ludl, Kensington

Site: Local: Beaverton, OR – USA Criação: 1970, juntamente com a Tektronix Maxtek Components Corp.

Serviços: Package Design – Ensuring Your Product's Success Test Services – Verifying Your Component Performance Manufacturing – US-based Assembly of Your Components Reliability & Failure Analysis – Identifying and Eliminating Potential Failures Project Management – From Design to Finished Component Maxtek Components Corp.

Site: - em contrução Local: Austin, TX - USA BridgePoint Technical Manufacturing

Serviços: BridgePoint Technical Manufacturing Test Development Product Engineering Probe/Final Manufacturing Test Burn-in Custom device programming, Inventory Electronic Assembly Product Analysis