© 2013 IBM Corporation Follow us Learn more at This document is for IBM and IBM Business.

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1 © 2013 IBM Corporation Follow us @IBMpowersystems@IBMpowersystems Learn more at www.ibm.com/powerwww.ibm.com/power This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients IBM Power Systems AM71/AS600 Technical Sales Common Skills Unidade 3 – Tecnologia

2 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 2 Objetivos da Unidade Os tópicos abaixo serão tratador nessa unidade:  Tópico 1 – POWER7 Reliability, Availability and Serviceability (RAS)  Tópico 2 – Tecnologia EnergyScale

3 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 3 Tópico 1: Reliability, Availability and Serviceability (RAS) Projetado para disponibilidade contínua Após completer esse tópico, você estará apto a:  Explicar por que disponibilidade continua é importante para os nossos clientes.  Listar as características de Power Systems que aumentam o RAS;  Listar os melhorias RAS em POWER7.

4 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 4 O RAS pode ser discutido em vários níveis  RAS hardware é mais do que apenas processador RAS; –Caches, controladoras I/O, subsistemas de memória, subsistemas I/O, I/O adapters, firmware, etc  RAS vai muito além do hardware e firmware camadas e inclui: –Middleware –Aplicações –Software de clustering –Soluções de partition mobility –Software de gerenciamento –IBM Director com software de gerenciamento Tivoli  Disponibilidade também pode ser discutida em vários níveis: –Disponibilidade de aplicativos –Disponibilidade Single "server" –Em um ambiente único sistema –Ou ambiente em cluster Source: Network World, dated July 14, 2009, reports on the 2009 ITIC Global Server Hardware & Server OS Reliability Survey Results AIX

5 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 5  Error Detection/Fault Isolation (First Failure Data Capture)  Chipkill memory  Service processor  Hot-swappable disks  Dynamic processor deallocation  Processor instruction retry  Alternate processor recovery  Dynamic deallocation: PCI bus slots  Hot-plug slots  Blind-swap slots in system unit  Redundant hot-plug power  Redundant hot-plug cooling  Hot-node add, hot-node repair, memory upgrade Características RAS no Hardware POWER

6 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 6 POWER7+ RAS Specific Features Nova Power On Reset Motor (PORE) -Permite que um processador possa ser re-inicializado com o sistema em funcionamento; -Usado diretamente para firmware simultâneo. Atualiza- se quando o valor da inicialização do processador registrado precisa ser mudado. Cache L3 - Coluna de reparação dinâmica -Nova capacidade de auto-cura que complementa a linha de delete do cache; -Usa a feature PORE para remover ou substituir uma falha na bit-line para uma reposição durante o tempo de execução. Nova Fabric Bus Dynamic Lane Repair -Usando do PORE, utiliza de lanes sobressalentes que podem ser reparadas dinamicamente (usando PORE); -Para os buses que ligam gavetas CEC; -Evita qualquer ação de reparo ou interrupção relacionada com uma falha de um único bit.

7 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 7 Guiding Light vs. Light Path Interface de usuário e ação reparadora de simplificação  POWER6 Guiding Light: Console-monitored system –Técnico usou o HMC ou ASMI para ver o que aconteceu e o que substituir; –FRUs e suas localizações são encontrados no log de erro; –HMC ou ASMI utilizados para inserir o código para ativar e identificar LEDs para verificar aonde estão os FRUs; –Taxas FRUs (CM ou dedicado) por instruções de procedimento; –LED do Sistema de Atenção é persistente após o ciclo de energia até que seja limpa pelo técnico;  POWER7 Light Path: Console-less HW service simplicity (rápido e fácil) –Não é necessário ver os logs, apenas troque os FRUs com o seu LED; LEDs são ativados automaticamente quando o erro é detectado; –Amigáveis, Etiquetas codificadas na capa mostram como puxar e ligar peças; –LED externo indica uma falha dentro da unidade; –LEDs internos por FRU indicam o que trocar; –FRUs são Hot Plug ou o sistema tem que ser desligado; LEDs de falhas em ouro cap powers fault LEDs quando a energia do sistema é removida; –Trocando um FRU automaticamente reseta os LEDs de falha; 7

8 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 8 Active Memory Mirroring for Hypervisor  Eliminar falhas de plataforma devido a erros incorrigíveis na memória;  Mantém duas cópias idênticas do Hypervisor na memória em todos os momentos;  Ambas as cópias são atualizadas simultaneamente com todas as mudanças;  No caso de uma falha de memória na cópia primária, a segunda cópia será convocada automaticamente e uma notificação será enviada à IBM através do Electronic Service Agent (ESA)  Padrão com 795 e 780, opcional para 770; Hypervisor Protegido Partição Tamanho da pool espelhada pode aumentar ou diminuir com base nas necessidades dp Hypervisor Partição Pool Memória Espelhada Pool Memória Espelhada Pool Memória não Espelhada

9 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 9 Ativa/Desativa Espelhamento de Memória Hypervisor / ASMI

10 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 10 POWER7 MANUTENÇÃO CONCORRENTE Aumenta a resiliência em Power Systems Inclui:  Componentes single processor;  Componentes de sigle memory;  Vários componentes de processador e memória;  As fontes de alimentação e reguladores;  Os processadores de serviço (Enterprise Systems);  Unidades de disco e adaptadores PCI;  12X I/O drawer remoção permanente;

11 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 11 Nova Terminologia POWER7 POWER6 CEC CM Terminology New POWER7 Terminology “Concurrent” when referring to CEC hardware“Hot” when referring to CEC hardware CCM: CEC Concurrent MaintenanceCHARM: CEC Hot Add & Repair Maintenance Concurrent Node AddHot Node Add Concurrent Node Upgrade (memory)Hot Node Upgrade (memory) Concurrent Hot Node Repair Concurrent Cold Node Repair Hot Node Repair Concurrent GX Adapter Add Concurrent Cold GX Adapter RepairHot GX Adapter Repair Concurrent System Controller Repair

12 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 12 CHARM Terminologia  CHARM – CEC Hot Add & Repair Maintenance: Adicionar, atualizar ou reparar de componentes de servidor sem uma interrupção de sistema. –Hot Add: adição de novo hardware sem interrupção do sistema. A quente. –Power-on repairs Hot repair: Hardware a ser reparado é eletricamente conectado ao sistema; Cold repair: Hardware a ser reparado é eletricamente isolado do sistema;  Non-concurrent repair: Reparação, enquanto o sistema está desligado; Processors Memory I/O Hubs (GX) Service Processor* System Clock* Processors Memory I/O Hubs (GX) Service Processor* System Clock* I/O Drawers I/O Adapters I/O Devices Power Components Cooling Components I/O Drawers I/O Adapters I/O Devices Power Components Cooling Components CEC System * External to CEC on 795

13 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 13 Item RAS Power 750+ Power 760+ Power 770+ Power 780+ Power 795 Redundant / Hot Swap Fans & Blowers ●●●●● Hot Swap DASD / Media / PCI Adapters ●●●●● Concurrent Firmware Update ●●●●● Redundant / Hot Swap Power Supplies ●●●●● Dual disk controllers (split backplane) ●●●●● Processor Instruction Retry ●●●●● Alternate Processor Recovery ●●●●● Redundant / Hot Swap Power Regulators ●●●●● PowerVM™/Live Part. Mobility/Live App Mobility ◙◙◙◙◙ Dynamic Processor Sparing ▬◙◙◙◙ Memory Sparing ▬▬◙◙◙ Redundant Service Processors ▬▬●* ● Redundant System Clocks ▬▬●* ● Hot GX Adapter Add and Cold Repair ▬▬●●● Hot-node Add / Cold-node Repair ▬▬●* Hot-node Repair / Hot-memory Add ▬▬●* Dynamic Service Processor &System Clock Failover ▬▬●* ● Hot-node Repair / Hot-memory Add for all nodes ** ▬▬●* Enterprise Memory ▬▬●●● Hot GX Adapter Repair ▬▬●●● Active Memory Mirroring for Hypervisor ▬▬◙●● Power Pools ▬▬▬●● ● Standard ◙ Optional ▬ Not Available * Requires two or more nodes POWER7+ Feature RAS

14 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 14 Electronic Service Agent (ESA)  Características: –Relatórios de erros e inventário do sistema; –Apoio Superior e Serviço; –O cliente pode visualizar dados de sistemas on-line;  Vantagens Cliente: –A alta disponibilidade –Fácil de usar –Problema relatado –Correções precisas –Auto-ajuda ao cliente

15 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 15 Sumário - Tópico 1 Agora você deve estar apto a:  Explique por que a disponibilidade continua é importane para os nosssos clientes.  Listar as características que aumentam o RAS em Power Systems;  Listar as melhorias de RAS em POWER7 systems.

16 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 16 Tópico 2: Tecnologia EnergyScale Depois de completer esse tópico, você estará apto a:  Explicar as características de POWER6 e POWER7 em energy-saving.  Descrever a Tecnologia EnergyScale de Power Systems  Descrever os benefícios de energia em Power System para os nossos cientes.

17 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 17  A redução de custos e prevenção –Identificar oportunidades de redução de custos de energia (Despesas Operacionais) Reduzir o excesso de provisionamento –Atraso devido à expansão das instalações de energia ou restrições de refrigeração; (Despesas de Capital)  Remover barreiras operacionais –Gerenciar poder e capacidade de resfriamento para permitir o crescimento e a flexibilidade –Controle de potência (modos, nivelamento, economia de energia) –Evite interrupções de serviço causadas por falhas relacionadas com a energia Identificação e reação a eventos de falha de energia  Gerenciar riscos e agilizar o cumprimento –Documentar e validar os ganhos de eficiência energética para as partes interessadas –Assegurar o cumprimento da regulação nova e emergente Regulamento do Governo está exigindo mais eficiência energética; Objetivos comuns para a gestão de energia

18 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 18 EnergyScale™ Technology Developed by IBM for Power Systems  EnergyScale fornece funções que ajudam os clientes a entender e controlar a forma como os servidores IBM utilizam energia e refrigeração;  Permite melhor controle do uso de energia de planejamento de instalações e de pico, resultando em economia de energia e de custos, aumentando a disponibilidade do sistema;  IBM Systems Director Active Energy Manager é necessário para gerenciar muitas funções EnergyScale;  O Active Energy Manager suporta as funcionalidades a seguir: –Power Trending –Thermal Reporting –Static Energy Saver Mode –Dynamic Energy Saver Mode –Energy Capping –Soft Energy Capping –Processor Nap –Energy Optimized Fan Control –Altitude Input –Processor Folding 18

19 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 19 IBM POWER6 EnergyScale Functions  Power / Thermal Trending –Coletar e relatar o consumo de energia, entrada e temperatura de exaustão  Power Capping –Static (hard) Power Save: Impõe um limite de potência através de tensão dinâmica e giro de frequência –Soft Power Cap: Tentativa de menor cap, mas não garantida.  Power States –Static Power Save (SPS): Reduz a frequência do processador e voltagem uma quantia fixa, reduzindo o consumo de energia ao mesmo tempo oferece um desempenho previsível; –Dynamic Power Save (DPS): Otimizar a potência versus desempenho utilizando Tensão Dinâmica e giro de frequência; –Dynamic Power Save - Favor Performance (DPS-FP): Economizar energia em baixas utilizações estados, mas maximizar o desempenho (acima nominal);

20 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 20 IBM POWER7 EnergyScale Enhancements  Gestão de energia melhorada  Sleep do Processor, Larger V/F drop –Intelligent VCPU folding, Higher Turbo Frequency –Energy Optimized Fans –Performance Aware Memory Throttling and Control –Dynamic Power Saver –Idle Power Saver –Processor Core Nap –Processor Winkle –Server Power Down –EnergyScale for I/O  Funções comuns em todos os sistemas - TPMD hardware on all POWER7 systems

21 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 21 TPMD: Dispositivo de gerenciamento de energia térmica  A separate micro-controller installed on all POWER7 systems –On the processor planar –Processador dedicado e aquisição de dados;  Monitora uso de energia e as temperaturas em tempo real  Responsável pela proteção térmica das placas de processador  Pode ajustar a potência do processador e desempenho em tempo real –Se a temperatura for superior a um limite superior (funcional), TPMD ativamente reduz o consumo de energia, reduzindo o processador. Tensão e frequência ou estrangulamento memória conforme necessário –Se a temperatura é menor que o limite superior (funcional), TPMD permite núcleos POWER7 para "over-clock" se estão presentes demandas de carga de trabalho;  Interage com o IBM Systems Director Active Energy Manager –Reporta informações de energia e energia termica. –Recebe entrada em políticas para ser definida;

22 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 22 Tópico 2 - Sumário Agora você deverá estar apto a:  Explicar as características do energy-saving de POWER6 e POWER7.  Descrever a Tecnologia EnergyScale de Power Systems  Descrever os benefícios da eficiência de energia em Power Systems para os clientes.

23 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 23 Resumo da unidade: Você deve esta familiarizado com os seguintes tópicos:  Tópico 1 – Tecnologia EnergyScale  Tópico 2 – POWER7 Características RAS (Reliability, Availability, and Serviceability)

24 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 24 This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings available in your area. Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785 USA. All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees either expressed or implied. All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and conditions. IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to qualified commercial and government clients. Rates are based on a client's credit rating, financing terms, offering type, equipment type and options, and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice. IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies. All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for their specific environment. Special Notices

25 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 25 IBM, the IBM logo, ibm.com, AIX, AIX (logo), AIX 5L, AIX 6 (logo), AS/400, Active Memory, BladeCenter, Blue Gene, Chiphopper, DB2, DB2 Universal Database, DS4000, DS6000, DS8000, EnergyScale, Enterprise Workload Manager, ESCON, GPFS, HACMP, HACMP/6000, i5/OS, i5/OS (logo), IBM Business Partner (logo), IBM Systems Director Active Energy Manager, IntelliStation, iSeries, LoadLeveler, Lotus, Lotus Notes, Micro- Partitioning, Notes, Operating System/400, OS/400, PartnerLink, PartnerWorld, POWER, Power Architecture, Power Everywhere, Power Family, POWER Hypervisor, Power Systems, Power Systems (logo), Power Systems Software, Power Systems Software (logo), POWER2, POWER3, POWER4, POWER4+, POWER5, POWER5+, POWER6, POWER7, PowerExecutive, PowerHA, PowerPC, PowerVM, PowerVM (logo), pSeries, pureScale, Rational, RISC System/6000, RS/6000, System i, System p, System p5, System Storage, System z, THINK, Tivoli, Tivoli (logo), Tivoli Enterprise Console, WebSphere, Workload Partitions Manager, X-Architecture, xSeries, z/OS and zSeries are trademarks or registered trademarks of International Business Machines Corporation in the United States, other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at "Copyright and trademark information" at www.ibm.com/legal/copytrade.shtml Adobe, the Adobe logo, PostScript, and the PostScript logo are either registered trademarks or trademarks of Adobe Systems Incorporated in the United States, and/or other countries. AltiVec is a trademark of Freescale Semiconductor, Inc. AMD Opteron is a trademark of Advanced Micro Devices, Inc. InfiniBand, InfiniBand Trade Association and the InfiniBand design marks are trademarks and/or service marks of the InfiniBand Trade Association. Intel, Intel logo, Intel Inside, Intel Inside logo, Intel Centrino, Intel Centrino logo, Celeron, Intel Xeon, Intel SpeedStep, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. IT Infrastructure Library is a registered trademark of the Central Computer and Telecommunications Agency which is now part of the Office of Government Commerce. Java and all Java-based trademarks and logos are trademarks or registered trademarks of Oracle and/or its affiliates. Linear Tape-Open, LTO, the LTO Logo, Ultrium, and the Ultrium logo are trademarks of HP, IBM Corp. and Quantum in the U.S. and other countries. Linux is a registered trademark of Linus Torvalds in the United States, other countries or both. Microsoft, Windows and the Windows logo are registered trademarks of Microsoft Corporation in the United States, other countries or both. NetBench is a registered trademark of Ziff Davis Media in the United States, other countries or both. SPECint, SPECfp, SPECjbb, SPECweb, SPECjAppServer, SPEC OMP, SPECviewperf, SPECapc, SPEChpc, SPECjvm, SPECmail, SPECimap and SPECsfs are trademarks of the Standard Performance Evaluation Corp (SPEC). The Power Architecture and Power.org wordmarks and the Power and Power.org logos and related marks are trademarks and service marks licensed by Power.org. TPC-C and TPC-H are trademarks of the Transaction Performance Processing Council (TPPC). UNIX is a registered trademark of The Open Group in the United States, other countries or both. Other company, product and service names may be trademarks or service marks of others. Special Notices (cont.)

26 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 26 Notes on Performance Estimates rPerf for AIX rPerf (Relative Performance) is an estimate of commercial processing performance relative to other IBM UNIX systems. It is derived from an IBM analytical model which uses characteristics from IBM internal workloads, TPC and SPEC benchmarks. The rPerf model is not intended to represent any specific public benchmark results and should not be reasonably used in that way. The model simulates some of the system operations such as CPU, cache and memory. However, the model does not simulate disk or network I/O operations. rPerf estimates are calculated based on systems with the latest levels of AIX and other pertinent software at the time of system announcement. Actual performance will vary based on application and configuration specifics. The IBM eServer pSeries 640 is the baseline reference system and has a value of 1.0. Although rPerf may be used to approximate relative IBM UNIX commercial processing performance, actual system performance may vary and is dependent upon many factors including system hardware configuration and software design and configuration. Note that the rPerf methodology used for the POWER6 systems is identical to that used for the POWER5 systems. Variations in incremental system performance may be observed in commercial workloads due to changes in the underlying system architecture. All performance estimates are provided "AS IS" and no warranties or guarantees are expressed or implied by IBM. Buyers should consult other sources of information, including system benchmarks, and application sizing guides to evaluate the performance of a system they are considering buying. For additional information about rPerf, contact your local IBM office or IBM authorized reseller. ======================================================================== CPW for IBM i Commercial Processing Workload (CPW) is a relative measure of performance of processors running the IBM i operating system. Performance in customer environments may vary. The value is based on maximum configurations. More performance information is available in the Performance Capabilities Reference at: www.ibm.com/systems/i/solutions/perfmgmt/resource.htmlwww.ibm.com/systems/i/solutions/perfmgmt/resource.html

27 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 27 The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor. IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html.http://www.ibm.com/systems/p/hardware/system_perf.html All performance measurements were made with systems running the AIX operating system unless otherwise indicated to have used Linux. For new and upgraded systems, AIX Version 4.3, AIX 5 or AIX 6 were used. All other systems used previous versions of AIX. The SPEC CPU2006 and SPEC CPU2000 benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C for AIX v11.1, XL C/C++ for AIX v11.1, XL FORTRAN for AIX v13.1, XL C/C++ for Linux v11.1, and XL FORTRAN for Linux v13.1. For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor. TPChttp://www.tpc.orghttp://www.tpc.org SPEChttp://www.spec.orghttp://www.spec.org LINPACKhttp://www.netlib.org/benchmark/performance.pdfhttp://www.netlib.org/benchmark/performance.pdf PTC Creo (formerly Pro/E)http://www.ptc.com/products/creo/http://www.ptc.com/products/creo/ GPC http://www.spec.org/gwpg/http://www.spec.org/gwpg/ VolanoMark http://www.volano.comhttp://www.volano.com STREAMhttp://www.cs.virginia.edu/stream/http://www.cs.virginia.edu/stream/ SAP http://www.sap.com/solutions/benchmark/index.epxhttp://www.sap.com/solutions/benchmark/index.epx Oracle Applicationshttp://www.oracle.com/us/solutions/benchmark/apps-benchmark/index-166919.htmlhttp://www.oracle.com/us/solutions/benchmark/apps-benchmark/index-166919.html ANSYS FLUENThttp://www.ansys.com/Support/Platform+Support/Benchmarks+Overviewhttp://www.ansys.com/Support/Platform+Support/Benchmarks+Overview TOP500 Supercomputershttp://www.top500.org/http://www.top500.org/ Ideas Internationalhttp://www.ideasinternational.com/Free-Advisory/Benchmark-Gatewayhttp://www.ideasinternational.com/Free-Advisory/Benchmark-Gateway Storage Performance Councilhttp://www.storageperformance.org/resultshttp://www.storageperformance.org/results Notes on Benchmarks and Values

28 © 2013 IBM Corporation IBM Power Systems This document is for IBM and IBM Business Partner use only. It is not intended for client distribution or use with clients 28 Notes on HPC Benchmarks and Values The IBM benchmarks results shown herein were derived using particular, well configured, development-level and generally-available computer systems. Buyers should consult other sources of information to evaluate the performance of systems they are considering buying and should consider conducting application oriented testing. For additional information about the benchmarks, values and systems tested, contact your local IBM office or IBM authorized reseller or access the Web site of the benchmark consortium or benchmark vendor. IBM benchmark results can be found in the IBM Power Systems Performance Report at http://www.ibm.com/systems/p/hardware/system_perf.html.http://www.ibm.com/systems/p/hardware/system_perf.html All performance measurements were made with systems running AIX or AIX 5L operating systems unless otherwise indicated to have used Linux. For new and upgraded systems, the latest versions of AIX were used. All other systems used previous versions of AIX. The LINPACK, and Technical Computing benchmarks were compiled using IBM's high performance C, C++, and FORTRAN compilers for AIX and Linux. For new and upgraded systems, the latest versions of these compilers were used: XL C for AIX V11.1, XL C/C++ for AIX V11.1, XL FORTRAN for AIX V13.1, XL C/C++ for Linux V11.1, and XL FORTRAN for Linux V13.1. Linpack HPC (Highly Parallel Computing) used the current versions of the IBM Engineering and Scientific Subroutine Library (ESSL). For Power7 systems, IBM Engineering and Scientific Subroutine Library (ESSL) for AIX Version 5.1 and IBM Engineering and Scientific Subroutine Library (ESSL) for Linux Version 5.1 were used. For a definition/explanation of each benchmark and the full list of detailed results, visit the Web site of the benchmark consortium or benchmark vendor. SPEChttp://www.spec.orghttp://www.spec.org LINPACKhttp://www.netlib.org/benchmark/performance.pdfhttp://www.netlib.org/benchmark/performance.pdf PTC Creo (formerly Pro/E)http://www.ptc.com/products/creo/http://www.ptc.com/products/creo/ GPC http://www.spec.org/gwpg/http://www.spec.org/gwpg/ STREAMhttp://www.cs.virginia.edu/stream/http://www.cs.virginia.edu/stream/ TOP500 Supercomputershttp://www.top500.org/http://www.top500.org/ AMBERhttp://ambermd.org/http://ambermd.org/ GAMESShttp://www.msg.chem.iastate.edu/gamesshttp://www.msg.chem.iastate.edu/gamess GAUSSIANhttp://www.gaussian.comhttp://www.gaussian.com ANSYS FLUENThttp://www.ansys.com/services/hardware-support-db.htmhttp://www.ansys.com/services/hardware-support-db.htm ABAQUShttp://www.simulia.com/support/v68/v68_performance.phphttp://www.simulia.com/support/v68/v68_performance.php ECLIPSEhttp://www.sis.slb.com/content/software/simulation/index.asp?seg=geoquest&http://www.sis.slb.com/content/software/simulation/index.asp?seg=geoquest& MM5http://www.mmm.ucar.edu/mm5/http://www.mmm.ucar.edu/mm5/ MSC.NASTRANhttp://www.mscsoftware.com/support/prod%5Fsupport/nastran/performance/v04_sngl.cfmhttp://www.mscsoftware.com/support/prod%5Fsupport/nastran/performance/v04_sngl.cfm STAR-CDhttp://www.cd-adapco.com/products/star_cd/performance/406/index.htmlhttp://www.cd-adapco.com/products/star_cd/performance/406/index.html NAMDhttp://www.ks.uiuc.edu/Research/namdhttp://www.ks.uiuc.edu/Research/namd HMMERhttp://hmmer.janelia.org/http://hmmer.janelia.org/ http://powerdev.osuosl.org/project/hmmerAltivecGen2mod